STPS2L25U ? october 1998 - ed: 3a low drop power schottky rectifier i f(av) 2 a v rrm 25 v tj (max) 150 c v f (max) 0.375 v main product characteristics very low forward voltage drop for less power dissipation optimized conduction/reverse losses trade-off which means the highest efficiency in the applications features and benefits single schottky rectifier suited to switched mode power supplies and high frequency dc to dc con- verters. packaged in smb (jedec do214-aa), this device is especially intended for use in parallel with mos- fets in synchronous rectification. description smb symbol parameter value unit v rrm repetitive peak reverse voltage 25 v i f(rms) rms forward current 10 a i f(av) average forward current t l = 125c d = 0.5 2 a i fsm surge non repetitive forward current tp = 10 ms sinusoidal 75 a i rrm repetitive peak reverse current tp=2 m s square f=1khz 1 a i rsm non repetitive peak reverse current tp = 100 m s square 1 a t stg storage temperature range - 65 to + 150 c tj maximum operating junction temperature * 150 c dv/dt critical rate of rise of reverse voltage 10000 v/ m s absolute ratings (limiting values) * : dptot dtj < 1 rth ( j - a ) thermal runaway condition for a diode on its own heatsink 1/4
symbol parameter value unit r th(j-l) junction to lead 25 c/w thermal resistances symbol tests conditions tests conditions min. typ. max. unit i r * reverse leakage current tj = 25 cv r = v rrm 90 m a tj = 125 c1530ma v f * forward voltage drop tj = 25 ci f = 2 a 0.45 v tj = 125 c 0.325 0.375 tj = 25 ci f = 4 a 0.53 tj = 125c 0.43 0.51 static electrical characteristics pulse test : * tp = 380 m s, d < 2% to evaluate the maximum conduction losses use the following equation : p = 0.24 x i f(av) + 0.068 i f 2 (rms) 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 0.0 0.2 0.4 0.6 0.8 1.0 1.2 if(av) (a) pf(av)(w) d = 0.2 d = 0.5 d = 1 d = 0.05 d = 0.1 t d =tp/t tp fig. 1: average forward power dissipation versus average forward current. 0 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 if(av)(a) rth(j-a)=100c/w rth(j-a)=rth(j-l) tamb(c) t d =tp/t tp fig. 2: average forward current versus ambient temperature ( d =0.5). STPS2L25U 2/4
1e-3 1e-2 1e-1 1e+0 0 1 2 3 4 5 6 7 8 9 10 im(a) ta=25c ta=100c ta=50c t(s) i m t d =0.5 fig. 3: non repetitive surge peak forward current versus overload duration (maximum values). 1e-2 1e-1 1e+0 1e+1 1e+2 5e+2 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-a)/rth(j-a) d = 0.1 d = 0.2 d = 0.5 single pulse t d =tp/t tp fig. 4: relative variation of thermal impedance junction to ambient versus pulse duration. 0 5 10 15 20 25 1e-3 1e-2 1e-1 1e+0 1e+1 1e+2 ir(ma) tj=125c tj=25c tj=100c tj=150c vr(v) fig. 5: reverse leakage current versus reverse voltage applied (typical values). 12 5102030 10 100 500 vr(v) c(pf) f=1mhz tj=25c fig. 6: junction capacitance versus reverse voltage applied (typical values). 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.01 0.10 1.00 10.00 ifm(a) tj=125c tj=25c tj=100c vfm(v) typical values tj=150c fig. 7: forward voltage drop versus forward cur- rent (maximum values). 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 20 40 60 80 100 120 s(cu) (cm2) rth(j-a) (c/w) fig. 8: thermal resistance junction to ambient ver- sus copper surface under tab (epoxy printed circuit board fr4, copper thickness: 35 m m). STPS2L25U 3/4
package mechanical data smb e c l e1 d a1 a2 b ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 d 3.30 3.95 0.130 0.156 l 0.75 1.60 0.030 0.063 1.52 2.75 2.3 1.52 foot print dimensions (in millimeters) information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsib ility for the conse quences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without expres s written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 1998 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - france - germany - italy - japan - korea - malaysia - malta - mexico - morocco - the netherlands - singapore - spain - sweden - switzerland - taiwan - thailand - united kingdom - u.s.a. http://www.st.com ordering type marking package weight base qty delivery mode STPS2L25U g23 smb 0.107g 2500 tape & reel band indicates cathode epoxy meets ul94,v0 STPS2L25U 4/4
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